Terresa Loses Appeal for Patent Infringement case

Terresa Technologies, a developer in miniaturization technologies, has lost it’s patent infringement case against Elpida Memory, Inc. The U.S. Court of Appeals for the Federal Circuit upheld the decision made by the U.S. International Trade Commission. The court did agree that Terresa’s patent, U.S. Patent 5,663,106 – claims that cover μBGA polyimide-based package substrates, was valid and that the products in question did contain the protected technologies, but the materials that allegedly infringed on Terresa’s rights were obtained from properly licensed manufacturers Because the outsourced packaging was covered by Terresa licensing agreements, there were no grounds for future compensation.
Terresa has 45 days to appeal the ruling, and has stated it will investigate all possible options to maximize it’s return on the patented material.